HIU是模塊的模塊間總線（IMB）的接入點。它還提供

功率分配和本地可編程處理功率。HIU是

I/O模塊直接連接到IMB背板。HIU對于大多數(shù)高

完整性I/O類型，并具有類型相關(guān)和產(chǎn)品范圍通用功能。每個HIU

包含三個獨立的切片，通常稱為A、B和C。

三個切片之間的所有互連都包含隔離，有助于防止任何故障

切片之間的相互作用。每個切片都被視為故障控制區(qū)（FCR），如下所示

一個切片上的故障對其他切片的操作沒有影響。

HIU為系列中的模塊提供以下通用服務(wù)：

?通過IMB與TMR處理器進行高速容錯通信

界面

?切片之間的FCR互連總線，用于對傳入的IMB數(shù)據(jù)進行投票和分發(fā)

輸出I/O模塊數(shù)據(jù)到IMB。

?與FIU切片的電隔離串行數(shù)據(jù)接口。

?雙24 Vdc機箱電源電壓和電源的冗余電源共享

對HIU電路的邏輯功率進行調(diào)節(jié)。

?FIU切片的磁隔離電源。

?模塊狀態(tài)LED的FPU串行數(shù)據(jù)接口。

?活動模塊和備用模塊之間的SmartSlot鏈接，用于在

模塊更換。

?數(shù)字信號處理，用于執(zhí)行本地數(shù)據(jù)減少和自我診斷。

?用于存儲模塊操作、配置和現(xiàn)場I/O的本地內(nèi)存資源

數(shù)據(jù)

?車載內(nèi)務(wù)管理，監(jiān)控參考電壓、電流消耗

和板溫度。

The HIU is the point of access to the Inter-Module Bus (IMB) for the Module. It also provides

power distribution and local programmable processing power. The HIU is the only section of

the I/O Module to directly connect to the IMB Backplane. The HIU is common to most high

integrity I/O types and has type dependent and product range common functions. Each HIU

contains three independent slices, commonly referred to as A, B, and C.

All interconnections between the three slices incorporate isolation to help prevent any fault

interaction between the slices. Each slice is considered a Fault Containment Region (FCR), as

a fault on one slice has no effect on the operation of the other slices.

The HIU provides the following services common to the Modules in the family:

? High Speed Fault Tolerant Communications with the TMR Processor via the IMB

interface.

? FCR Interconnect Bus between slices to vote incoming IMB data and distribute

outgoing I/O Module data to the IMB.

? Galvanically isolated serial data interface to the FIU slices.

? Redundant power sharing of dual 24 Vdc chassis supply voltage and power

regulation for logic power to HIU circuitry.

? Magnetically isolated power to the FIU slices.

? Serial data interface to the FPU for Module status LEDs.

? SmartSlot link between Active and Standby Modules for co-ordination during

Module replacement.

? Digital Signal Processing to perform local data reduction and self-diagnostics.

? Local memory resources for storing Module operation, configuration, and field I/O

data.

? On-board housekeeping, which monitors reference voltages, current consumption

and board temperature.